Burn-in and Test Sockets

• 0.22mm Pitch and Greater • Dual Row QFN Socket Options Available • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Optional Heat Sink and Case Contacts • PTH or Compression Mount Contacts • Optional “Heat Pipe” to Printed Circuit Board • Zero-insertion-force • 1,300+ ClamShell and Open Top QFN Sockets

• 0.22mm Pitch and Greater • Accommodates Package Height Variations • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Contacts Connect Solder ball to Board Pad • Optional Heat Sink • Low Profile and Small Footprint • Zero-insertion-force • Surface Mount Design / Solder-Free

• Kelvin, Double Duty Kelvin, and Non Kelvin • Zero Insertion Force Clam Shell Design • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Optional Case Contacts • Optional Heat Sinking • Fine Pitches • Contact Wiping Action for Reliable Connection

• Top-Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Small Size Offers Maximum Board Density • Package Standoffs Aid Package Removal • Wide Funnel Entry Guides Package Leads • Positive Contact Wiping Action • Low Profile and Small Footprint • ClamShell Socket Design

• Easy Loading and Unloading • Positive Contact Wiping Action • Open Top and Clam Shell Designs • 0.25 mm and Greater Pitches • Dual Height Contact Options • Live or Dead Bug Loading Options • Low Profile and Small Footprint • Open Top Designs Independent of Package Height

• Top Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Zero Insertion Force Clamshell Designs • Low Insertion Force Open Top Designs • Optional Multiple Devices per Socket • 0.25 mm pitches and Greater • Distance Between Package Sides with Leads is Defined as the Package Width Dimension

• Kelvin and Non Kelvin Contacts • Building Block Strip Sockets • Accepts Various Lead Diameters • Contact Wiping Action on Lead Diameter • Optional Mounting Ears for Screw Mounting • Modifications Available • Various Pitches Available

• 0.22mm Pitch and Greater • Accommodates Package Height Variations • Non-Magnetic Socket Options Available • Accurate, Tightly-controlled Package Fit • Contacts Connect Land pad to Board Pad • Optional Heat Sink • Low Profile and Small Footprint • Zero-insertion-force Surface Mount Design / Solder-Free

• Standard and Custom Designs • For Microwave Packages • For Custom Module Packages • Optional 50 Ohm Impedance Designs with Matching Board Layouts • Optional Heat Sinks • Optional Direct Contact of Device Leads onto Board Traces

• Independent Contacts • Pitches of 0.100″, 0.150″ and 0.156″ • Heavy Duty for Long Life • V Slot Guides Insertion of Board • For Board Thickness of 0.054″ to 0.070″ • Optional Mounting Ears • Non-Bifurcated Contacts for Increased Current • Positive Wiping Action for Reliable Contact

• Kelvin and Non Kelvin • Top Loading • For In-line TO and SIP Packages • Modified and Custom Sockets Available • May Accommodate More than One Package • Fit is Independent of Package Body L, W and H • Various Pitches Available

• Top-Loading and Clam Shell Designs • Kelvin and Single-Sided Contacts • Modified and Custom Sockets Available • Variety of Pitches and Package Lead Sizes • For In-line and Zig-Zag Packages • Positive Contact Wiping Action • Optional Zero-Insertion Force

• Top Loading Designs • High Side Contacts Help Align Package Leads • Positive Contact Wiping Action • Low Insertion Force • Bottom Socket Standoffs Help Board Cleaning • Various Sizes and I/O • Unloading Tool Also Available

• Open Top and Clam Shell Designs • Accommodate Standard Carriers • Rugged Construction • Wire-Formed Contacts • Solid Clamping of Device Carrier • Various Sizes and I/O Available

• Kelvin Alligator Clips • Up to 175 C Use • Optional Attached Wiring • Reliable, Normally Closed Contacts • Torque Wrench Kits also Available for Socket Assembly • Fixed and Variable Torque Wrench Kits